JPH0715152Y2 - 電子機器の保護構造 - Google Patents
電子機器の保護構造Info
- Publication number
- JPH0715152Y2 JPH0715152Y2 JP1989029190U JP2919089U JPH0715152Y2 JP H0715152 Y2 JPH0715152 Y2 JP H0715152Y2 JP 1989029190 U JP1989029190 U JP 1989029190U JP 2919089 U JP2919089 U JP 2919089U JP H0715152 Y2 JPH0715152 Y2 JP H0715152Y2
- Authority
- JP
- Japan
- Prior art keywords
- expansion
- resin
- protective
- contraction
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 60
- 239000011347 resin Substances 0.000 claims description 60
- 230000001681 protective effect Effects 0.000 claims description 30
- 230000008602 contraction Effects 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 16
- 230000000694 effects Effects 0.000 claims description 6
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 239000002184 metal Substances 0.000 description 6
- 230000002950 deficient Effects 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989029190U JPH0715152Y2 (ja) | 1989-03-14 | 1989-03-14 | 電子機器の保護構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989029190U JPH0715152Y2 (ja) | 1989-03-14 | 1989-03-14 | 電子機器の保護構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02120873U JPH02120873U (en]) | 1990-09-28 |
| JPH0715152Y2 true JPH0715152Y2 (ja) | 1995-04-10 |
Family
ID=31253186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989029190U Expired - Lifetime JPH0715152Y2 (ja) | 1989-03-14 | 1989-03-14 | 電子機器の保護構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0715152Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2527301Y2 (ja) * | 1991-05-10 | 1997-02-26 | 矢崎総業株式会社 | 回転検出装置 |
| JP2528053Y2 (ja) * | 1991-07-24 | 1997-03-05 | 三洋電機株式会社 | 混成集積回路 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187560U (ja) * | 1984-05-24 | 1985-12-12 | 日本電気株式会社 | 電子回路パツケ−ジの組立構造 |
| JPS62193771U (en]) * | 1986-05-30 | 1987-12-09 | ||
| JPH01113391U (en]) * | 1988-01-26 | 1989-07-31 |
-
1989
- 1989-03-14 JP JP1989029190U patent/JPH0715152Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02120873U (en]) | 1990-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |